Feb 8, 2007
From STDFGroup
STDF Scan datalog meeting Notes
Date: 8 Feb 2007
Attendees:
Glenn Plowman - Qualcomm
Ajay Khoche - Verigy
Phil Burlinson - Inovys
Cy Hay - Synopsys
Ping Wen - Yield Dynamics
Andreas Leininger – Infineon
John Rowe - Teradyne
Mary Israni - BCS
Claire Faydide - ST
Agenda:
- Discuss datamodel for Chip ID
- Discuss Test identification terminology
- Next meeting
Minutes:
Discussion on datamodel for Chip ID
Discussions could not be held due to Oracle meeting problems. Ajay sent the data model document to the group for review
Discussion on Test identification terminology
- Cy Hay (Synopsys) presented the terminology for test identification. The presentation is available on the web.
- Following clarification points were observed during the presentation.
- TestMode: The mode ID can be reflected in the pattern name
- PatternSet: Multiple patterns can be merged into a burst on an ATE so the standard should account for this case
- ScanProcedure:
- Diagnostics tool will take care of diagnosis from the compressed patterns
- Will OCI provide the information on compressed outputs?
- Failure data:
- Standard should allow specification of the truncation criteria
- Flexible set of capabilities for truncation should be supported.
- Expected data: Required for 3\-state measurements only
- *Split Pattern Diagnostics: Correct offset should be communicated to the diagnostics tool. Similarly the correct offset should be communicated for merged patterns as well.
Next Meeting:
- Next meeting on Feb 22^nd^.
- Ajay will be on vacation so Andreas will run the meeting
- John Rowe to make WebEx arrangements
New Action Items:
- Review data model for the Part Identification – Ajay
- Present the use cases and terminology – Glenn, Davide, Phil & Cy
